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Chip manufacturer TSMC inks $100bn deal to build more US plants
04 March 2025
Progress on construction at TSMC’s fab in Arizona (Image: TSMC)
Taiwanese chip manufacturer TSMC has signed a deal to invest $100 billion in the construction of three new semiconductor fabrication plants in the US, along with two other facilities.
The latest deal, signed by TSMC CEO and chairman Dr. C.C. Wei and US President Donald Trump on Monday 3 March at the White House, is in addition to TSMC’s $65 billion investment in its advanced semiconductor manufacturing operations in Phoenix, Arizona.
The expansion includes plans for three fabrication plants, two advanced packaging facilities, and a research and development team centre.
TSMC said the move would support 40,000 construction jobs over the next four years, as well as creating thousands of high-paid tech jobs.
“Back in 2020, thanks to President Trump’s vision and support, we embarked on our journey of establishing advanced chip manufacturing in the United States. This vision is now a reality,” said Dr. Wei.
“With the success of our first fab in Arizona, along with needed government support and strong customer partnerships, we intend to expand our US semiconductor manufacturing investment by an additional $100 billion, bringing our total planned investment to $165 billion,” he added.
TSMC’s Arizona fab currently employs more than 3,000 people on 1,100 acres of land in Arizona. The site has been in volume production since late 2024.
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