Intel to receive $20bn from US government to supercharge semiconductor manufacturing

Engineer showing a computer microchip on motherboard background. Electronic circuit board with processor. Image: uflypro via AdobeStock -

The US government is to provide chip company Intel with nearly $20 billion in grants and loans to help it to build new semiconductor manufacturing facilities, in addition to funds for research and development.

Making the announcement on Wednesday (20 March), US President Joe Biden said the move would create 20,000 new construction jobs in the country.

The funding comes through the bipartisan 2022 CHIPS and Science Act, which offers subsidies for the research, development and manufacture of chips.

Intel is planning to invest more than $20 billion in the construction of two new chip factories in Ohio, spanning nearly 1,000 acres in Licking County, just outside of Columbus. The site can accommodate a total of eight chip factories.

The US government’s support for the construction of new domestic semiconductor ‘fabs’ comes as it attempts to reduce its reliance on China and Taiwan for chip manufacturing.

Intel is also expected to modernize its sites in New Mexico and Oregon, as well as expanding operations in Arizona where rival Taiwan Semiconductor is also building a new fab.


Receive the information you need when you need it through our world-leading magazines, newsletters and daily briefings.

Sign up

Andy Brown Editor, Editorial, UK - Wadhurst Tel: +44 (0) 1892 786224 E-mail: [email protected]
Neil Gerrard Senior Editor, Editorial, UK - Wadhurst Tel: +44 (0) 7355 092 771 E-mail: [email protected]
Catrin Jones Deputy Editor, Editorial, UK – Wadhurst Tel: +44 (0) 791 2298 133 E-mail: [email protected]
Eleanor Shefford Brand Manager Tel: +44 (0) 1892 786 236 E-mail: [email protected]